Hiksemi Mage20 Pro Personal Cloud NAS Price in Pakistan | Skyrs

PRODUCT DATA SHEET: HIKSEMI FUTURE SERIES DDR GAMING MEMORY

The HIKSEMI FUTURE Series DDR UDIMM memory modules are engineered specifically for high-performance PC enthusiasts, hardcore gamers, and heavy-workload content creators. Featuring high-qua

DATA SHEET: HIKSEMI PERSONAL CLOUD NAS MAGE20 PRO

The Hiksemi Personal Cloud NAS Mage20 Pro is a high-performance, dual-bay network-attached storage solution engineered for secure data centralization, automated home and business backups, and seamless multi-device file sharing. Distributed natively in Pakistan, this flagship private cloud device balances consumer-friendly accessibility with enterprise-grade stability.


PRODUCT VARIANTS (SKYRS PAKISTAN EDITION)

Hiksemi distributes the Mage20 Pro through SKYRS in multiple localized variant setups to suit diverse storage demands.

  • Mage20 Pro (Diskless / Enclosure Only): The baseline hardware unit allowing users to supply their own compatible 2.5-inch or 3.5-inch SATA hard drives.

  • Mage20 Pro 8TB Bundle: Pre-fitted and optimized with 2 x 4TB Surveillance/NAS grade internal storage drives.

  • Mage20 Pro 16TB Bundle: Pre-fitted and optimized with 2 x 8TB High-Endurance NAS hard drives.

  • Mage20 Pro 40TB Max Bundle: Equipped with 2 x 20TB Enterprise-grade high-capacity drives for maximal data hoarding and dense backup archives.


TECHNICAL SPECIFICATIONS

  • Processor: High-efficiency Quad-Core ARM Cortex Architecture CPU

  • Memory: High-speed DDR4 System Memory

  • Storage Interface: Dual-Bay (2-Slots) supporting 2.5” / 3.5” SATA HDD or SSD

  • Maximum Internal Capacity: Up to 40TB (2 x 20TB drives)

  • Network Interfaces: 1 x 2.5Gbps High-Speed Ethernet Port (RJ45)

  • External Connectivity: 1 x USB-A 3.2 Gen 1 (Front Panel), 1 x USB-A (Rear Panel)

  • Cooling System: Smart Ultra-Quiet 4cm Internal Cooling Fan

  • Power Supply: Compact 12V / 3A Low-Power Adapter

  • Operating System: Proprietary Hiksemi OS (Managed natively via Hikbox App)


DEPLOYMENT AND INSTALLATION

Physical Setup

  1. Drive Unboxing and Insertion: Power down the enclosure. Remove the outer casing shell and mount your 2.5-inch or 3.5-inch SATA drives into the internal drive sleds. Fasten them securely using the provided mounting screws.

  2. Network Connectivity: Connect one end of a Cat6 (or above) network cable to the 2.5G Ethernet port on the back of the Mage20 Pro, and connect the other end directly to a LAN port on your primary Wi-Fi router or network switch.

  3. Powering On: Connect the 12V 3A power brick to the DC port at the back of the unit and plug it into a stable wall outlet. Press the power button; the LED indicators will blink as the device boots into a ready state.


SYSTEM CONFIGURATION

Software Initialization

  1. App Installation: Download the official Hikbox Application from the Google Play Store or Apple App Store onto your mobile device. Alternatively, download the desktop application for Windows or macOS.

  2. Device Pairing: Ensure your smartphone or computer is connected to the exact same local Wi-Fi/LAN network as the NAS. Open the Hikbox App, register a master account, and tap “Add Device.” The app will auto-scan the local network and discover the Mage20 Pro.

  3. Storage Initialization: Follow the on-screen prompts to format the inserted hard drives. Choose your preferred storage mode (RAID 1 for complete data mirroring and safety, or Large/JBOD mode for combined maximum capacity).

  4. Remote Access & Users: Enable remote access within the settings menu to connect to your files securely outside of the home network without complex port forwarding. Invite family members or team members by creating isolated individual accounts with private password-protected spaces.


AVAILABILITY NOTICE

The Hiksemi Personal Cloud NAS Mage20 Pro along with all official pre-configured storage bundles, official local warranty validation, and technical hardware support is available exclusively at SKYRS in Pakistan.

ality, rigorously screened IC chips and a heavy-duty metal aluminum heatsink (available with dynamic customizable RGB lighting profiles), this flagship series unlocks exceptional overclocking headroom, minimizes latency, and ensures system stability under extreme computing conditions.


TECHNICAL SPECIFICATIONS & VARIANT MATRIX

The FUTURE Series spans both established high-speed DDR4 and next-generation DDR5 platforms, offered in highly flexible single-module or dual-channel kit configurations to address diverse system architectures

Memory Generation Available Capacities Frequency / Speeds Voltage Profile Support Pin Count
FUTURE DDR4

8GB / 16GB / 32GB (Single)

 

16GB / 32GB / 64GB (Kits)

3200 MHz

 

3600 MHz

 

4000 MHz

1.35V – 1.4V Intel XMP 2.0 288-Pin UDIMM
FUTURE DDR5

16GB / 32GB (Single)

 

32GB / 64GB (Kits)

6000 MHz / 6400 MHz

 

7200 MHz / 8000 MHz

1.1V – 1.4V Intel XMP 3.0 / AMD EXPO 288-Pin UDIMM

ENVIRONMENTAL & MECHANICAL METRICS

  • Form Factor: Unbuffered DIMM (UDIMM) for Desktop Computing

  • Heat Dissipation: Premium Aviation-grade Metal Heatsink (with integrated RGB light guide diffuse bar)

  • Physical Dimensions: 133.25mm × 31.25mm × 3.77mm (With Heatsink structural assembly)

  • Operational Temperature Tolerance: 0°C to 85°C


DEPLOYMENT, INSTALLATION, AND CONFIGURATION

To fully capitalize on raw memory frequencies and maintain cross-component electrical stability, systemic handling rules must be carefully followed.

Physical Hardware Deployment

  1. Static Elimination & Safety: Power off the computer entirely and isolate the power supply block (switch off PSU and unplug power cable). Discharge any remaining system capacitors by holding down the PC chassis power button for 5 seconds. Wear an anti-static wrist strap.

  2. Slot Identification (Dual-Channel Architecture): For standard 4-slot motherboards, optimize memory channel loading by utilizing slots A2 and B2 (typically slots 2 and 4 from the CPU socket) to establish stable dual-channel operation.

  3. Seating Layout: Open the mechanical retaining clips on the chosen memory channels. Match the physical gap notch on the bottom edge of the FUTURE DDR module with the mechanical alignment key inside the slot. Apply uniform downwards force on both corners of the stick simultaneously until the plastic clips engage with a distinct mechanical locking click.

System Configuration & Overclocking

  1. Firmware Navigation: Boot up the machine and tap the ‘Del’ or ‘F2’ keys continuously to enter the motherboard’s UEFI/BIOS interface.

  2. XMP / EXPO Profiling: Move to the Overclocking (OC) or Advanced Memory Settings page. Locate the Intel XMP (Extreme Memory Profile) or AMD EXPO option and toggle it from “Disabled” or “Auto” to “Profile 1”. This tells the system to automatically adjust voltage and primary timings to achieve target speeds (e.g., 3600MHz on DDR4 or 6000+MHz on DDR5).

  3. Verification Validation: Save your setting modifications and restart the system. Open the Windows Task Manager (Performance tab) or CPU-Z software utility to verify that the RAM is fully recognized and clocking at its certified optimal operating speed.


EXCLUSIVE PAKISTAN CHANNEL AVAILABILITY NOTICE

Critical Distribution Directive: Premium system integration services, specialized hardware deployment, configuration execution, and official inventory distribution for all variants of the HIKSEMI FUTURE Series DDR Memory are available exclusively through SKYRS in Pakistan. SKYRS maintains sole operational oversight for genuine consumer warranties, certified technical support, and authentic product provisioning nationwide.

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